Vectrawave Broadband Devices and Subsystems
VectraWave was founded in 2006 to provide OEM’s with a partner with well-rounded expertise in the most advanced Microwave, RF and Optical/RF technologies and design techniques. This unique combination of engineering and manufacturing depth is the cornerstone of component designs that enable improved system performance, lower manufacturing cost, and accelerated time to market.
VectraWave is focused on DC to millimeter-wave single function to highly integrated semiconductors and ASICs, system-in-package (SIP) modules, and multi-chip modules (MCM) for microwave, RF and lightwave applications. SiP technology is being embraced as an ideal solution for applications that demand miniaturization with sophisticated functionality. SiP also provides the added benefit of compatibility with die design changes and integration of various die technologies (e.g., Si, GaAs, SiGe, SOI, MEMS).
The core of the company is an international team of respected technologists with proven experience in the spectrum of disciplines involved with the design and manufacturing of high performance, high reliability complex integrated products.